The 11th International Workshop on Materials Behavior at the Micro- and Nano- Scale

Invited Speaker

C.Cem Tasan Massachusetts Institute of Technology
Daniel Caillard Centre d'Elaboration de Matériaux et d'Etudes Structurales
Dashan Shang Institute of Physics,  Chinese Academy of Sciences
Douglas Stauffer Bruker
Emmanuel Clouet Service de Recherches de Metallurgie Physique
Evan Ma Johns Hopkins University
Han Huang University of Queensland
Horst Hahn Karlsruhe Institute of Technology
Jian Luo University of California, San Diego
Jian Wang University of Nebraska-Lincoln
Jianyu Huang Yanshan Univeristy
Jianzhong Yuan JEOL
Ju Li Massachusetts Institute of Technology
Korimilli Eswar Prasad Indian Institute of Technology (IIT) Indore
Kui Du Institute of metal research,  Chinese Academy of Sciences
Litao Sun Southeast University
Lucile Dezerald Institut Jean Lamour, Université de Lorraine
Matteo Seita Nanyang Technological University
Michael Short Massachusetts Institute of Technology
Ming Xu Huazhong University of Science and Technology
Mingxin Huang The University of Hong Kong 
Roman Groger Academy of Sciences of the Czech Republic
Ruopeng Zhang University of California, Berkeley,Lawerence Berkeley National Lab 
Shen J Dillon University of Illinois at Urbana-Champaign 
Shigenobu Ogata Osaka University
Shiyu Du Ningbo Institute of Materials Technology and Engineering,CAS
Tomohito Tsuru Japan Atomic Energy Agency
Xiaofeng Zhang  Hitachi High Technologies America
Yan Chen South China University of Technology
Yang Lu City University of Hong Kong
Yong Zhu North Carolina State University
Yujun Xie Yale University
Zhenyu Zhang Dalian University of Technology 

Important Dates

Workshop website registration

March 1st, 2018

Abstract submission begins

March 1st, 2018

Abstract submission deadline

April 1st, 2018

Advanced registration deadline

May 15th, 2018

Contact Information

Contact Eamil:

Contact Telephone:

Contact Address:
28 West Xianning Road, Xi'an, Shaanxi 710049, P. R. China Xi’an Jiaotong University

Powered by · Manage Conference